Approximate arithmetic circuits: A survey, characterization, and recent applications

H Jiang, FJH Santiago, H Mo, L Liu… - Proceedings of the …, 2020 - ieeexplore.ieee.org
Approximate computing has emerged as a new paradigm for high-performance and energy-
efficient design of circuits and systems. For the many approximate arithmetic circuits …

A survey of optimization techniques for thermal-aware 3D processors

K Cao, J Zhou, T Wei, M Chen, S Hu, K Li - Journal of Systems Architecture, 2019 - Elsevier
Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Robust machine learning systems: Challenges, current trends, perspectives, and the road ahead

M Shafique, M Naseer, T Theocharides… - IEEE Design & …, 2020 - ieeexplore.ieee.org
Currently, machine learning (ML) techniques are at the heart of smart cyber-physical
systems (CPSs) and Internet-of-Things (loT). This article discusses various challenges and …

{V0LTpwn}: Attacking x86 processor integrity from software

Z Kenjar, T Frassetto, D Gens, M Franz… - 29th USENIX Security …, 2020 - usenix.org
Fault-injection attacks have been proven in the past to be a reliable way of bypassing
hardware-based security measures, such as cryptographic hashes, privilege and access …

A survey of fault-tolerance techniques for embedded systems from the perspective of power, energy, and thermal issues

S Safari, M Ansari, H Khdr, P Gohari-Nazari… - IEEE …, 2022 - ieeexplore.ieee.org
The relentless technology scaling has provided a significant increase in processor
performance, but on the other hand, it has led to adverse impacts on system reliability. In …

Machine learning for power, energy, and thermal management on multicore processors: A survey

S Pagani, PDS Manoj, A Jantsch… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
Due to the high integration density and roadblock of voltage scaling, modern multicore
processors experience higher power densities than previous technology scaling nodes …

Asic clouds: Specializing the datacenter

I Magaki, M Khazraee, LV Gutierrez… - ACM SIGARCH Computer …, 2016 - dl.acm.org
GPU and FPGA-based clouds have already demonstrated the promise of accelerating
computing-intensive workloads with greatly improved power and performance. In this paper …

Towards energy-efficient and secure edge AI: A cross-layer framework ICCAD special session paper

M Shafique, A Marchisio, RVW Putra… - 2021 IEEE/ACM …, 2021 - ieeexplore.ieee.org
The security and privacy concerns along with the amount of data that is required to be
processed on regular basis has pushed processing to the edge of the computing systems …

New trends in dark silicon

J Henkel, H Khdr, S Pagani, M Shafique - Proceedings of the 52nd …, 2015 - dl.acm.org
This paper presents new trends in dark silicon reflecting, among others, the deployment of
FinFETs in recent technology nodes and the impact of voltage/frquency scaling, which lead …

TSP: Thermal safe power: Efficient power budgeting for many-core systems in dark silicon

S Pagani, H Khdr, W Munawar, JJ Chen… - Proceedings of the …, 2014 - dl.acm.org
Chip manufacturers provide the Thermal Design Power (TDP) for a specific chip. The
cooling solution is designed to dissipate this power level. But because TDP is not …