Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical
stage in solar cell manufacturing. In order to improve the production yield of the cutting …

For slicing crystalline silicon ingots, we have developed a novel fixed‐abrasive wire where
diamond grit is fixed onto a bare wire by resin bonding. The properties of the wafers sliced …

For over 20 years, wire sawing has been the primary method used for slicing ingots of
silicon, sapphire, and silicon carbide into wafer substrates. Fixed diamond wire sawing has …

Wafer production with multi-wire sawing leads to a high consumption of wire and a relatively
high offcut (kerf loss) of high purity silicon material. In this paper a new approach to reduce …

Photovoltaic (PV) power generation is critical to many climate policy goals, as PV electricity
results in little or no greenhouse gas (GHG) emissions during use, utilities and governments …

This work presents the evolution from fundamental single wire sawing experiments using
structured wire for the first time to the introduction of this wire in multi-crystalline silicon wafer …

Multi-wire sawing process has been widely used for wafer slicing of silicon substrates for
solar cells. Usually there are two different kinds of wire saw in multi-wire sawing process …

This paper discusses the manufacturing process of magnetic-field-assisted abrasive sensing
for electroplated diamond cutting wires. The study uses a magnetization device to partially …

In this work, various reciprocating cycle times of 80, 160, 240, and 320 sec in the diamond
wire sawing (DWS) process were adjusted to improve the slicing ability in solar industry …

An approach of a texturing process combining surface modification by ultra-short pulsed
laser radiation and etching techniques is developed. The hybrid process is divided into two …