Phonon-engineered extreme thermal conductivity materials
Materials with ultrahigh or low thermal conductivity are desirable for many technological
applications, such as thermal management of electronic and photonic devices, heat …
applications, such as thermal management of electronic and photonic devices, heat …
Recent progress on the effects of impurities and defects on the properties of Ga 2 O 3
Ga2O3 is attractive for power devices and solar-blind ultraviolet photodetectors due to its
ultra-wide bandgap, large breakdown field, and favorable stability. However, it is difficult to …
ultra-wide bandgap, large breakdown field, and favorable stability. However, it is difficult to …
Ultrahigh thermal conductivity in isotope-enriched cubic boron nitride
Materials with high thermal conductivity (κ) are of technological importance and fundamental
interest. We grew cubic boron nitride (cBN) crystals with controlled abundance of boron …
interest. We grew cubic boron nitride (cBN) crystals with controlled abundance of boron …
High thermal conductivity in wafer-scale cubic silicon carbide crystals
High thermal conductivity electronic materials are critical components for high-performance
electronic and photonic devices as both active functional materials and thermal …
electronic and photonic devices as both active functional materials and thermal …
Carrier-phonon decoupling in perovskite thermoelectrics via entropy engineering
Thermoelectrics converting heat and electricity directly attract broad attentions. To enhance
the thermoelectric figure of merit, zT, one of the key points is to decouple the carrier-phonon …
the thermoelectric figure of merit, zT, one of the key points is to decouple the carrier-phonon …
Interfacial thermal conductance across room-temperature-bonded GaN/diamond interfaces for GaN-on-diamond devices
The wide bandgap, high-breakdown electric field, and high carrier mobility makes GaN an
ideal material for high-power and high-frequency electronics applications, such as wireless …
ideal material for high-power and high-frequency electronics applications, such as wireless …
Phonon thermal transport and its tunability in GaN for near-junction thermal management of electronics: A review
The heat dissipation issue has now become one of the most important bottlenecks for power
electronics due to the rapid increase in power density and working frequency. Towards the …
electronics due to the rapid increase in power density and working frequency. Towards the …
High in-plane thermal conductivity of aluminum nitride thin films
High thermal conductivity materials show promise for thermal mitigation and heat removal in
devices. However, shrinking the length scales of these materials often leads to significant …
devices. However, shrinking the length scales of these materials often leads to significant …
Prospects for wide bandgap and ultrawide bandgap CMOS devices
Power and RF electronics applications have spurred massive investment into a range of
wide and ultrawide bandgap semiconductor devices which can switch large currents and …
wide and ultrawide bandgap semiconductor devices which can switch large currents and …
Thermal Transport across Ion-Cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3–SiC Interfaces
The ultrawide band gap, high breakdown electric field, and large-area affordable substrates
make β-Ga2O3 promising for applications of next-generation power electronics, while its …
make β-Ga2O3 promising for applications of next-generation power electronics, while its …