Advanced packaging technology, also known as system scaling, bridges the gap between
chip and package sizes by mounting multiple chips on a single package substrate. 2.5-D …

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous
integration packages, are widely used in high I/O (Input/Output) density and high …

The escalating demand for high-performance computing is driving the expansion of high-
end packages, leading to increased power requirements. Efficient heat dissipation is crucial …

This study investigated the impact of an adhesion layer on Through Glass Via (TGV)
samples and studied the creep behavior of copper TGVs. TGV samples with and without an …

The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

The interconnections and chips of the internal components of electronic devices need to be
protected to prevent damage during shipping, handling, and daily use. This article studied …

As the industry moves towards miniaturization of electronics, the need for higher accuracy in
in-plane and out-of-plane deformation measurement techniques keeps increasing. Due to a …

This study is aimed to find correlation between the fatigue life and solder joint shape with
respect to component location in experimental and numerical approaches. The test vehicle …

Three types of radiation detectors usually can be found in the market: gas-filled detectors,
scintillation detectors, and solid-state detectors. The ion-chamber type of gas-filled was …