Review of silver nanoparticle based die attach materials for high power/temperature applications
SA Paknejad, SH Mannan - Microelectronics Reliability, 2017 - Elsevier
There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …
based solutions for harsh environment die attach. However, sintering nanoparticles is a …
Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
Sinter joining with Ag particle paste has emerged as a promising lead-free die-attachment
solution for power devices owing to its low-temperature and pressureless processing …
solution for power devices owing to its low-temperature and pressureless processing …
High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates
Ag sinter joining technology has been used in the advanced power applications to replace
conventional soldering technology due to its high temperature stability, along with its …
conventional soldering technology due to its high temperature stability, along with its …
Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
Robust bonding and thermal-stable sinter Ag joining on an Au finished substrate was first
time achieved for use in SiC power modules. Five kinds of Ag paste, including different …
time achieved for use in SiC power modules. Five kinds of Ag paste, including different …
Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints
In this paper, the effect of different surface finish metallization layers (Cu, Ni, Au and Ag) on
the shearing fracture toughness of sintered Ag bonded joints under various sintering …
the shearing fracture toughness of sintered Ag bonded joints under various sintering …
Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications
In order to overcome interfacial delamination of pressureless sintered nanosilver as die
attachment on the ENIG finish, we tried to clarify the densification and interfacial diffusion …
attachment on the ENIG finish, we tried to clarify the densification and interfacial diffusion …
Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0 Ag-0.5 Cu and interlayer formation of multi-element intermetallic …
High-entropy alloy (HEA) FeCoNiCu (FCNC) can be potentially employed in electronic
packaging because it contains commonly used substrate metals. However, its …
packaging because it contains commonly used substrate metals. However, its …
Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm2 Power Cycling Tests
C Chen, D Kim, Z Zhang, N Wakasugi… - … on Power Electronics, 2022 - ieeexplore.ieee.org
In this article, an SiC die was directly attached on a bare DBA (Al/AlN/Al) substrate via
micron-sized Ag sintering at 250° C without pressure. The micron-sized structure of the Ag …
micron-sized Ag sintering at 250° C without pressure. The micron-sized structure of the Ag …
Fabrication of high-strength Cu–Cu joint by low-temperature sintering micron–nano Cu composite paste
Y Peng, Y Mou, J Liu, M Chen - Journal of Materials Science: Materials in …, 2020 - Springer
To solve the problems of high cost of nano-metal paste and high porosity of die-attach layer,
a novel and cost-effective micro–nano Cu composite paste was prepared and demonstrated …
a novel and cost-effective micro–nano Cu composite paste was prepared and demonstrated …
Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating
In the next generation power electronics packaging, sinter Ag joining technology has
become popular for use as a die attach and is receiving greater attention. Herein, it is …
become popular for use as a die attach and is receiving greater attention. Herein, it is …