Heat spreaders with interlocked inserts
AR Antoniswamy, S Jain, ZZ Tang, W Hu - US Patent 10,969,840, 2021 - Google Patents
Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related
devices and methods. In some embodiments, a heat spreader may include: a frame formed …
devices and methods. In some embodiments, a heat spreader may include: a frame formed …
Customized integrated heat spreader design with targeted doping for multi-chip packages
S Kothari, A Antoniswamy - US Patent App. 16/794,815, 2021 - Google Patents
Embodiments include semiconductor packages. A semiconductor package includes a first
die and a second die on a package substrate, and an integrated heat spreader (IHS) over …
die and a second die on a package substrate, and an integrated heat spreader (IHS) over …