Study of the impact of flake Al2O3 abrasive and Nn-Butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers
Z Du, R Wang, X Chen, Y Zhu, Z Liang, T Zheng… - Surfaces and …, 2024 - Elsevier
For the backside CMP of TSV (Through Silicon Via), improving the rate selectivity ratio of Si
and Cu, rapidly exposing the copper column on the backside of TSV, and obtaining atomic …
and Cu, rapidly exposing the copper column on the backside of TSV, and obtaining atomic …
Testing Significance of Layout Dependent Impacts on Silicon Chips Performance
S Kakde, N Khan - 2023 3rd International Conference on …, 2023 - ieeexplore.ieee.org
Layout Dependent Effects (LDE) plays a vital role in layout of analog and digital circuits.
These effects are directly affects the performance of the integrated circuits. If you did not pay …
These effects are directly affects the performance of the integrated circuits. If you did not pay …