[HTML][HTML] Platinum silicide formation on selected semiconductors surfaces via thermal annealing and intercalation

K Idczak, S Owczarek, L Markowski - Applied Surface Science, 2022 - Elsevier
In this work, platinum silicide formation on selected semiconductors surfaces: Si (1 0 0), Si (1
1 1), 4H-SiC (0 0 0 1) and graphene–4H-SiC (0 0 0 1), via thermal annealing and …

Local sensor based on nanowire field effect transistor from inhomogeneously doped silicon on insulator

DE Presnov, IV Bozhev, AV Miakonkikh… - Journal of Applied …, 2018 - pubs.aip.org
We present the original method for fabricating a sensitive field/charge sensor based on field
effect transistor (FET) with a nanowire channel that uses CMOS-compatible processes only …

Experimental and theoretical electronic structure determination for PtSi

N Franco, JE Klepeis, C Bostedt, T Van Buuren… - Physical Review B, 2003 - APS
We present a complete experimental and theoretical electronic structure study of PtSi using
a combination of synchrotron radiation photoelectron spectroscopy (SR-PES), soft x-ray …

High-temperature characteristics of AlxGa1− xN/GaN Schottky diodes

Z Xiaoling, L Fei, L Changzhi, X Xuesong… - Journal of …, 2009 - iopscience.iop.org
High-temperature characteristics of the metal/Al x Ga 1− x N/GaN M/S/S (M/S/S) diodes have
been studied with current–voltage (I–V) and capacitance–voltage (C–V) measurements at …

STM studies of PtSi formation on Si (111) by solid state epitaxy

A Wawro, S Suto, A Kasuya - Physical Review B—Condensed Matter and …, 2005 - APS
Formation process and surface structure of platinum silicide thin layers have been studied
using scanning tunneling microscopy. The investigated structures have been grown by solid …

Fabrication of sub-micron etch-resistant metal/semiconductor structures using resistless electron beam lithography

J Beauvais, D Drouin, E Lavallee - US Patent 6,261,938, 2001 - Google Patents
(57) ABSTRACT A method for fabricating a Sub-micron Structure of etch resistant
metal/semiconductor compound on a Substrate of Semiconductor material comprises the …

Electrical properties of platinum interconnects deposited by electron beam induced deposition of the carbon-free precursor, Pt (PF3) 4

C O'Regan, A Lee, JD Holmes, N Petkov… - Journal of Vacuum …, 2013 - pubs.aip.org
Comprehensive analysis of the electrical properties, structure and composition of Pt
interconnects, developed via mask-less, electron beam induced deposition of the carbon …

[PDF][PDF] Guided Formation of a Sub‐10 nm Silicide Dot Array on an Area Patterned by Electron‐Beam Lithography

JS Wi, TY Lee, HM Kim, HS Lee, SW Nam… - Advanced …, 2007 - academia.edu
The fabrication of patterned arrays of sub-10 nm dots is an important research goal because
of the potential application of these structures in single-electron devices,[1, 2] photonic …

Valence band study of the PtSi by synchrotron radiation photoelectron spectroscopy

N Franco, JE Klepeis, C Bostedt, T Van Buuren… - Journal of Electron …, 2001 - Elsevier
The electronic structure of PtSi was measured using synchrotron radiation-based valence
band (VB) photoelectron spectroscopy (PES). We have compared our experimental results …

Resistless electron beam lithography process for the fabrication of sub-50 nm silicide structures

D Drouin, J Beauvais, E Lavallée, S Michel… - Journal of Vacuum …, 1997 - pubs.aip.org
We report on a study of the fabrication of submicron silicide structures with a resistless
lithography technique. Several different metals can be used as a basis for producing silicide …