Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review
Due to the miniaturization development in the electronic packaging industry and the
significant thermal management requirement for high-power electronic devices, the sintered …
significant thermal management requirement for high-power electronic devices, the sintered …
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions
TT Dele-Afolabi, MAA Hanim, R Calin… - Microelectronics …, 2020 - Elsevier
In this work, multi-walled carbon nanotubes (MWCNTs) reinforced Sn-5Sb/Cu composite
solder joints were synthesized and the effects of MWCNTs addition on the microstructure …
solder joints were synthesized and the effects of MWCNTs addition on the microstructure …
Creep life prediction for Sn-5Sb lead-free solder alloy: Model and experiment
H Vafaeenezhad, SH Seyedein, MR Aboutalebi… - Microelectronic …, 2019 - Elsevier
Extensive application of the newly developed lead-free solder alloys demands thorough
acquaintance and deep understanding of their in-service behavior and performance. A Sn …
acquaintance and deep understanding of their in-service behavior and performance. A Sn …