Fabrication of InGaAs-on-insulator substrates using direct wafer-bonding and epitaxial lift-off techniques
Defect less semiconductor-on-insulator (-OI) by a cost-effective and low-temperature
process is strongly needed for monolithic 3-D integration. Toward this, in this paper, we …
process is strongly needed for monolithic 3-D integration. Toward this, in this paper, we …