The thermal boundary conductance (TBC) of materials pairs in atomically intimate contact is
reviewed as a practical guide for materials scientists. First, analytical and computational …

This study presents a detailed investigation of the atomic structures and electronic properties
of NbC (111)/Cu (111) interfaces using first-principles calculations based on density …

Diamond powder with an average particle size of 200 μm was coated with tungsten and
tungsten carbide coatings of thickness 260 nm. Pulse Plasma Sintering (PPS) was then …

Interface design is essential for diamond/Cu (Dia/Cu) composites to achieve high thermal
conductivity (TC), due to the incompatibility between diamond particles and Cu matrix. In this …

Using pressureless infiltration of copper into a bed of coarse (180 μm) diamond particles pre-
coated with tungsten, a composite with a thermal conductivity of 720 W/(m K) was prepared …

Aiming at developing high thermal conductivity copper/diamond composite, an
unconventional approach applying self-assembled monolayer (SAM) prior to the high …

The thermal conductivity of packed beds of various materials (metals, ceramics, superhard
materials, polymers, etc.) is measured by the steady-state heat flux method at room …

Abstract Thermal conductivity of SiCp/Cu composites was usually far below the expectation,
which is usually attributed to the low real thermal conductivity of matrix. In the present work …

Diamond/copper composite has been considered as one of the next generation thermal
management materials. Interfacial modification is an essential means of ameliorating …

High-density diamond/Cu composites with good thermal properties were fabricated by low-
temperature hot-press sintering via designing dual layers on diamond. The microstructure …