Design of ultracompact gate driver integrated with current sensor and commutation path for a 211-kW three-level SiC aircraft propulsion inverter
The aviation industry is increasingly interested in high-efficiency and high-density electric
propulsion systems enabled by high-power silicon carbide (SiC) modules. However …
propulsion systems enabled by high-power silicon carbide (SiC) modules. However …
Design of Rogowski coil current sensor integrated with busbar and gate driver for 211 kW SiC-based three-level T-type inverter
The high-power motor drives is increasingly used in the electric vehicles, railway, and more
electric aircraft. The application of Silicon Carbide (SiC) devices and multi-level topologies …
electric aircraft. The application of Silicon Carbide (SiC) devices and multi-level topologies …
Development of LTCC-packaged optocouplers as optical galvanic isolation for high-temperature applications
P Lai, D Gonzalez, S Madhusoodhanan, A Sabbar… - Scientific Reports, 2022 - nature.com
This paper reports high-temperature optocouplers for signal galvanic isolation. Low
temperature co-fired ceramic (LTCC) technology was used in the design and fabrication of …
temperature co-fired ceramic (LTCC) technology was used in the design and fabrication of …
Measurement of power frequency current including low-and high-order harmonics using a Rogowski coil
The measurement of a power frequency current including low-and high-order harmonics is
of great importance in calibration as well as in testing processes. Therefore, this paper …
of great importance in calibration as well as in testing processes. Therefore, this paper …
PCB Rogowski Coil Array with Discrete Electrostatic Shielding for Current Measurement of Paralleled Chips in Power Devices
Y Zhan, G Feng, J Wan, X Li, R Jin… - … on Power Electronics, 2024 - ieeexplore.ieee.org
Printed Circuit Board (PCB) Rogowski coil array is capable of measuring the currents of the
paralleled chips inside power devices, the operating status and failure behaviour of power …
paralleled chips inside power devices, the operating status and failure behaviour of power …
A Self-Healing Magnetic-Array-Type Current Sensor with Data-Driven Identification of Abnormal Magnetic Measurement Units
X Liu, K Ma, J Liu, W Zhao, L Peng… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Magnetic-array-type current sensors have garnered increasing popularity owing to their
notable advantages, including broadband functionality, a large dynamic range, cost …
notable advantages, including broadband functionality, a large dynamic range, cost …
[PDF][PDF] High-Temperature SiC Power Module with Integrated LTCC-Based Gate Driver
P Lai, S Chinnaiyan, D Gonzalez… - CS MANTECH …, 2022 - researchgate.net
This paper proposes a high-temperature SiC power module. High-temperature gate drivers
were fabricated on low temperature co-fired ceramic (LTCC) substrates and integrated into …
were fabricated on low temperature co-fired ceramic (LTCC) substrates and integrated into …
Effect of shielding on Rogowski coil transducer performance and the equivalent circuit model
ME Ibrahim, NA Mohamed, A El-Morshedy… - IEEE Sensors …, 2022 - ieeexplore.ieee.org
Rogowski coil is sensitive to current surges in nearby systems. Hence, if it is used to
measure a current in a system and a current surge occurs in a nearby location to this system …
measure a current in a system and a current surge occurs in a nearby location to this system …
Demonstration and Optimization of a 250° C LTCC-based Gate Driver for High Density, High-Temperature Power Modules
S Chinnaiyan, DG Castillo, P Lai… - … on Power Electronics …, 2023 - ieeexplore.ieee.org
This paper proposes a gate driver design for high-temperature power module applications
based on low-temperature cofired ceramic (LTCC) substrates. The proposed gate drivers …
based on low-temperature cofired ceramic (LTCC) substrates. The proposed gate drivers …
Mechanism analysis of dual wavelength laser welding AlN-PC joint based on microtexture treatment
D Sun, N Jiang, C Ni, Y Liu, Y Chen, L Jiang… - Optics & Laser …, 2025 - Elsevier
High-strength interfacial bonding between ceramics and transparent polymers is hardly to
be achieved, especially in the field of optical packaging of biochips. This paper proposes a …
be achieved, especially in the field of optical packaging of biochips. This paper proposes a …