Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

Cu wire is drastically replacing Au wire due to surge of Au price. However, Cu wire package
has poorer humidity reliability than Au wire package. Although Pd coated Cu wire package …

Wire bonding is popular first-level interconnect method used in the semiconductor device
packaging. Gold (Ag) wire is often used in high-reliability applications. Typical wire …

Microelectronic reliability requirements are tightening to a standard of near zero ppb defects
due to the evolution of self-driving cars and wearable electronics. The successful transition …

In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used
to make bonding samples, and the influence of Pd-layer thickness on the reliability of …

This study investigated the electrochemical characterizations in the field of wire metallurgy
(Pd concentration) and molding compound chemistry (chloride concentration) to find ways to …

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its
significant cost savings over gold wire. However, concerns on corrosion susceptibility and …

In this study, newly developed quaternary micro-alloyed Cu wires (MACs) with added trace
amount of noble metals (Pt, Au, and Pd) added were compared with 4N Cu and Au/Pd …

There is growing interest in copper (Cu) wire bonding due to its significant cost savings over
gold wire. However, concerns regarding package reliability and corrosion susceptibility have …

In this paper, the growth kinetics of Cu–Al intermetallic compounds formed during isothermal
annealing of Pd–Cu wire bonds with different palladium distribution at 175° C are …