[PDF][PDF] Testing of Droplet-Based Microelectrofluidic Systems.
Composite microsystems that integrate mechanical and fluidic components are fast
emerging as the next generation of system-on-chip designs. As these systems become …
emerging as the next generation of system-on-chip designs. As these systems become …
Dense matrix inversion of linear complexity for integral-equation-based large-scale 3-D capacitance extraction
W Chai, D Jiao - IEEE transactions on microwave theory and …, 2011 - ieeexplore.ieee.org
State-of-the-art integral-equation-based solvers rely on techniques that can perform a dense
matrix-vector multiplication in linear complexity. We introduce the H 2 matrix as a …
matrix-vector multiplication in linear complexity. We introduce the H 2 matrix as a …
Fast -Matrix-Based Direct Integral Equation Solver With Reduced Computational Cost for Large-Scale Interconnect Extraction
W Chai, D Jiao - IEEE Transactions on Components, Packaging …, 2013 - ieeexplore.ieee.org
In this paper, we propose a fast H-matrix-based direct solution with a significantly reduced
computational cost for an integral-equation-based capacitance extraction of large-scale 3-D …
computational cost for an integral-equation-based capacitance extraction of large-scale 3-D …
A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction
W Chai, D Jiao, CK Koh - Proceedings of the 46th Annual Design …, 2009 - dl.acm.org
State-of-the-art integral-equation-based solvers rely on techniques that can perform a matrix-
vector multiplication in O (N) complexity. In this work, a fast inverse of linear complexity was …
vector multiplication in O (N) complexity. In this work, a fast inverse of linear complexity was …
Linear-Complexity Direct and Iterative Integral Equation Solvers Accelerated by a New Rank-Minimized -Representation for Large-Scale 3-D Interconnect …
W Chai, D Jiao - IEEE transactions on microwave theory and …, 2013 - ieeexplore.ieee.org
We develop a new rank-minimized H 2-matrix-based representation of the dense system
matrix arising from an integral-equation (IE)-based analysis of large-scale 3-D interconnects …
matrix arising from an integral-equation (IE)-based analysis of large-scale 3-D interconnects …
An LU decomposition based direct integral equation solver of linear complexity and higher-order accuracy for large-scale interconnect extraction
W Chai, D Jiao - IEEE Transactions on Advanced Packaging, 2010 - ieeexplore.ieee.org
A fast LU factorization of linear complexity is developed to directly solve a dense system of
linear equations for the capacitance extraction of any arbitrary shaped 3-D structure …
linear equations for the capacitance extraction of any arbitrary shaped 3-D structure …
ℋ-and ℋ2-matrix-based fast integral-equation solvers for large-scale electromagnetic analysis
W Chai, D Jiao - IET microwaves, antennas & propagation, 2010 - IET
Integral-equation (IE)-based methods generally lead to dense systems of linear equations.
The resulting matrices, although dense, can be thought of as 'data sparse', that is, they can …
The resulting matrices, although dense, can be thought of as 'data sparse', that is, they can …
Robust control of nonlinear dynamic systems
VK Pshikhopov, MY Medvedev - 2010 IEEE ANDESCON, 2010 - ieeexplore.ieee.org
In this paper a new method of a robust control design for nonlinear mu I til in keel dynamical
systems is developed. The design procedure is based on the direct Lyapnov method The …
systems is developed. The design procedure is based on the direct Lyapnov method The …
Efficient statistical capacitance variability modeling with orthogonal principle factor analysis
R Jiang, W Fu, JM Wang, V Lin… - ICCAD-2005. IEEE/ACM …, 2005 - ieeexplore.ieee.org
Due to the ever-increasing complexity of VLSI designs and IC process technologies, the
mismatch between a circuit fabricated on the wafer and the one designed in the layout tool …
mismatch between a circuit fabricated on the wafer and the one designed in the layout tool …
Fast capacitance extraction in multilayer, conformal and embedded dielectric using hybrid boundary element method
In modern VLSI circuits, metal conductors are separated by multiple planar, conformal or
embedded dielectric media. Previous algorithms based on Boundary Element Method …
embedded dielectric media. Previous algorithms based on Boundary Element Method …