ABSTRACT A method of forming a semiconductor device includes forming a lower coil
segment in a first dielectric layer over a substrate, forming a second dielectric layer over the …

(57) ABSTRACT A semiconductor package includes a first semiconductor device, a second
semiconductor device vertically positioned above the first semiconductor device, and a …

A semiconductor structure and a method are disclosed herein. The semiconductor structure
includes a dielectric waveguide vertically disposed between a first layer and a second layer …

(57) ABSTRACT A transmission line design includes a first transmission line configured to
transfer at least one first signal. The transmission line design further includes a second …

(57) ABSTRACT A semiconductor device includes: a first conductive line disposed on a
substrate, a second conductive line disposed on the substrate, and the second conductive …

8, 279, 008 B2 10/2012 Hsieh et al. 8, 427, 240 B2 4/2013 Hsieh et al. 8, 593, 206 B2
11/2013 Chen et al. 8, 610, 494 B1 12/2013 Jin et al. 8, 618, 631 B2 12/2013 Jin et al. 8 …

According to some embodiments, an integrated circuit device is disclosed. The integrated
circuit device include at least one inductor having at least one turn, a magnetic coupling ring …

(57) ABSTRACT A semiconductor device includes a first semiconductor Sub strate and a
second semiconductor Substrate laminated with an insulating layer, a first transmission line …

The disclosure relates to semiconductor structures and, more particularly, to waveguide
structures used in phonotics chip packaging and methods of manufacture. The structure …

A wireless transmitter includes a an amplifier; and a switchable transformer, coupled to the
amplifier, wherein the amplifier is configured to be coupled to the switchable transformer in …