As the feature sizes of integrated circuits approach their physical limits, 3D packaging has
emerged as a crucial technology for enhancing integration and extending Moore's Law. To …

While the linear viscoelastic characteristics of polymer composites have been extensively
studied, the nonlinear creep with progressive damage leading to the ultimate creep rupture …

In high-temperature working conditions, the temperature difference between parts is
common, and it is necessary to perform a temperature gradient test to predict creep behavior …

SnPb solder was widely used in electronic packaging for aerospace devices due to its high
reliability. However, its creep resistance is poor and can be improved by adding alloying …

The insulated gate bipolar transistor (IGBT) is one of the important electronic devices to
control the complex circuit system of electric high-speed trains. The reliable function of IGBT …

焊点在深空探测器的电子系统中承担机械支撑, 电气连接和信号通道的作用,
电子系统的失效也多由互连焊点的失效引起, 这与钎料在不同温度载荷下力学行为和微观组织的 …

The solder joints played a crucial role for the provide mechanical, thermal and electrical
continuity in electronics system for the deep space detector, the failure of the electronics …