Technology prospects for data-intensive computing
K Akarvardar, HSP Wong - Proceedings of the IEEE, 2023 - ieeexplore.ieee.org
For many decades, progress in computing hardware has been closely associated with
CMOS logic density, performance, and cost. As such, slowdown in 2-D scaling, frequency …
CMOS logic density, performance, and cost. As such, slowdown in 2-D scaling, frequency …
Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration
MP Hsu, CY Chen, HC Chang, ZJ Hong… - Applied Surface …, 2023 - Elsevier
Abstract The Cu-Cu bonding technology is an indispensable vehicle for achieving
heterogeneous integration, providing architects and designers with a new solution to …
heterogeneous integration, providing architects and designers with a new solution to …
A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
Carbon nanotube (CNT) is recently proposed as an alternative material for through-silicon
via (TSV) to meet the requirements for high-density scaling and 3-D stacking. In this article …
via (TSV) to meet the requirements for high-density scaling and 3-D stacking. In this article …
Multiphysics simulation study of thermal stress effects in nanoscale FinFETs heterogeneously integrated with GaN high-power device on silicon substrate
Heterogeneous integration enables high-density integration to improve system functionality,
but meanwhile brings reliability concerns due to the intensification of temperature and …
but meanwhile brings reliability concerns due to the intensification of temperature and …
Low-Temperature Area-Selective Metal Passivation Bonding Platform for Heterogeneous Integration
MP Hsu, WT Tsai, CY Chen, TY Kuo… - IEEE Electron …, 2024 - ieeexplore.ieee.org
This study explores a novel area-selective passivation bonding technology utilizing gold, a
crucial facilitator for heterogeneous integration, which fulfills the urgent demand for high …
crucial facilitator for heterogeneous integration, which fulfills the urgent demand for high …
Towards Scalable Sub-THz Massive MIMO: Beamforming ASICs and 3D Die-to-Die Interconnects
H Liew - 2024 - search.proquest.com
The incessant growth of wireless communication demand is driving the desire for massive
antenna arrays operating at mm-Wave to sub-THz carrier frequencies, where many GHz of …
antenna arrays operating at mm-Wave to sub-THz carrier frequencies, where many GHz of …
A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5 D/3D Integration
J Liao, B Jiao, J Zhang, S Liu, H Jiang… - … on Circuits and …, 2023 - ieeexplore.ieee.org
Chiplet is a critical technology in the post-Moore era, and the die-to-die (D2D) interconnect
is essential for communication between chiplets. Meanwhile, several edge-computing …
is essential for communication between chiplets. Meanwhile, several edge-computing …
A Novel Low-temperature Co-Co Direct Bonding for Future 3D Interconnection
X Qi, Y Ma, C Wang - 2023 24th International Conference on …, 2023 - ieeexplore.ieee.org
3D interconnection enables a significant performance leap in computing capability and
memory/processor fabrication. However, the shrinkage of interconnects pitch using common …
memory/processor fabrication. However, the shrinkage of interconnects pitch using common …