Thermal expansion coefficient tailoring of LAS glass-ceramic for anodic bondable low temperature co-fired ceramic application
Abstract The Li–Al–Si glass-ceramics were prepared by conventional glass-ceramic
fabrication method. The influences of Na 2 O content on the sintering property …
fabrication method. The influences of Na 2 O content on the sintering property …
Packaging methodology for RF devices using a BCB membrane transfer technique
S Seok, N Rolland, PA Rolland - Journal of micromechanics and …, 2006 - iopscience.iop.org
This paper presents a whole benzocyclobutene (BCB) film encapsulated 0-level packaging
using a wafer level BCB bonding technique. The wafer-scale membrane transfer technique …
using a wafer level BCB bonding technique. The wafer-scale membrane transfer technique …
Circularly polarized millimeter-wave antenna using 0-level packaging
E Herth, N Rolland, T Lasri - IEEE Antennas and wireless …, 2010 - ieeexplore.ieee.org
This letter presents a 60-GHz millimeter-wave antenna fabricated with a wafer-scale
packaging technology. A feeding network is designed in a coplanar waveguide (CPW)-fed …
packaging technology. A feeding network is designed in a coplanar waveguide (CPW)-fed …
Anodic bonding of glass–ceramics to stainless steel coated with intermediate SiO2 layer
The anodic bonding between glass–ceramics and stainless steel (No. 430#) which was
coated with SiO2 layer were investigated. The SiO2 layers with thickness comprised …
coated with SiO2 layer were investigated. The SiO2 layers with thickness comprised …
Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations
This paper reports on fabrication and design considerations of an integrated folded shorted-
patch chip-size antenna for applications in short-range wireless microsystems and operating …
patch chip-size antenna for applications in short-range wireless microsystems and operating …
Design, fabrication, and measurement of benzocyclobutene polymer zero-level packaging for millimeter-wave applications
S Seok, N Rolland, PA Rolland - IEEE transactions on …, 2007 - ieeexplore.ieee.org
This paper presents a whole benzocyclobutene (BCB) membrane zero-level packaging
using a wafer-level BCB bonding technique and a membrane transfer technique with silicon …
using a wafer-level BCB bonding technique and a membrane transfer technique with silicon …
Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology
PM Mendes, S Sinaga, A Polyakov… - … (IEEE Cat. No …, 2004 - ieeexplore.ieee.org
High-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for
three-dimensional integration of on-chip antennas and RF passive components (eg large …
three-dimensional integration of on-chip antennas and RF passive components (eg large …
Area-selective adhesive bonding using photosensitive BCB for WL CSP applications
A Polyakov, M Bartek… - J. Electron …, 2005 - asmedigitalcollection.asme.org
This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB
from Dow Co. The strength of the fabricated bonds is characterized using the wedge …
from Dow Co. The strength of the fabricated bonds is characterized using the wedge …
Wafer level packaging compatible with millimeter-wave antenna
This paper presents a technological process compatible process compatible with an above
integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for …
integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for …
A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications
S Seok, N Rolland, PA Rolland - Sensors and Actuators A: Physical, 2008 - Elsevier
This paper presents a zero-level packaging method using Pyrex glass wet-etched with pre-
defined benzocyclobutene (BCB) sealing rings in the wafer level to obtain a denser …
defined benzocyclobutene (BCB) sealing rings in the wafer level to obtain a denser …