It is well known that time-frequency analysis (TFA) characterises signals in time-frequency
plane. Theoretically, traditional non-parameterised TFA can analyze any signal, but it is …

Flip chip technology has been widely used in integrated circuit packages due to its
superiority of performance in various aspects. The solder joints sandwiched between chips …

Terahertz sparse deconvolution based on an iterative shrinkage algorithm is presented in
this study to characterize multilayered structures. With an upsampling approach, sparse …

Defect detection during pulse-echo ultrasonic testing (UT) is challenging when defects are
located in a dead zone where the echoes from the defects are overshadowed by …

Terahertz (THz) time-domain detection has emerged as a promising tool for nondestructive
testing due to its superior detection accuracy and sensitivity for both interfaces and internal …

Lamb wave techniques have been widely used for structural health monitoring (SHM) and
nondestructive testing (NDT). To deal with dispersive and multimodal problems of Lamb …

Lamb wave-based damage identification and localization methods hold the potential for
nondestructive evaluation and structural health monitoring. Dispersive and multimodal …

Significant research has been done in polymeric nanocomposites and progress has been
made in understanding nanofiller-polymer interface and interphase and their relation to …

A narrowband tone burst excitation is usually required in most Lamb wave inspection
techniques in order to reduce the dispersion effect and maintain mode purity, especially in …

Noise suppression of an echo signal plays an important role in high-frequency ultrasonic
testing of flip chips. This paper proposes an orthogonal matching pursuit (OMP) method …