OpenPiton: An open source manycore research framework
Industry is building larger, more complex, manycore processors on the back of strong
institutional knowledge, but academic projects face difficulties in replicating that scale. To …
institutional knowledge, but academic projects face difficulties in replicating that scale. To …
Three-dimensional integrated circuit design
To the observer, it would appear that New York city has a special place in the hearts of
integrated circuit (IC) designers. Manhattan geometries, which mimic the blocks and streets …
integrated circuit (IC) designers. Manhattan geometries, which mimic the blocks and streets …
Fabrication cost analysis and cost-aware design space exploration for 3-D ICs
3-D integration technology is emerging as an attractive alternative to increase the transistor
count for future chips. The majority of the existing 3-D integrated circuit (IC) research is …
count for future chips. The majority of the existing 3-D integrated circuit (IC) research is …
Paceline: Improving single-thread performance in nanoscale cmps through core overclocking
B Greskamp, J Torrellas - 16th International Conference on …, 2007 - ieeexplore.ieee.org
Under current worst-case design practices, manufacturers specify conservative values for
processor frequencies in order to guarantee correctness. To recover some of the lost …
processor frequencies in order to guarantee correctness. To recover some of the lost …
A multi-story power delivery technique for 3D integrated circuits
Integrating circuits in the vertical direction can alleviate interconnect related problems and
enable heterogeneous chips to be stacked in a single package with a small form factor. This …
enable heterogeneous chips to be stacked in a single package with a small form factor. This …
Full-chip thermal analysis for the early design stage via generalized integral transforms
PY Huang, YM Lee - IEEE transactions on very large scale …, 2009 - ieeexplore.ieee.org
The capability of predicting the temperature profile is critically important for timing estimation,
leakage reduction, power estimation, hotspot avoidance and reliability concerns during …
leakage reduction, power estimation, hotspot avoidance and reliability concerns during …
Architecting microprocessor components in 3D design space
B Vaidyanathan, WL Hung, F Wang… - … Conference on VLSI …, 2007 - ieeexplore.ieee.org
Interconnect is one of the major concerns in current and future microprocessor designs from
both performance and power consumption perspective. The emergence of three …
both performance and power consumption perspective. The emergence of three …
Two-dimensional and three-dimensional integration of heterogeneous electronic systems under cost, performance, and technological constraints
R Weerasekera, D Pamunuwa… - … on Computer-Aided …, 2009 - ieeexplore.ieee.org
Present day market demand for high-performance high-density portable hand-held
applications has shifted the focus from 2-D planar system-on-a-chip-type single-chip …
applications has shifted the focus from 2-D planar system-on-a-chip-type single-chip …
Cost-aware three-dimensional (3D) many-core multiprocessor design
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various
applications from both area and performance perspectives. While the general trend in …
applications from both area and performance perspectives. While the general trend in …
Thermal resistance measurements of interconnections, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack
K Matsumoto, Y Taira - 2009 25th Annual IEEE Semiconductor …, 2009 - ieeexplore.ieee.org
As device-scaling challenges increase, three-dimensional (3D) integrated circuits (ICs) are
receiving more attention for system performance enhancements, due to their higher …
receiving more attention for system performance enhancements, due to their higher …