Simulation of high-speed interconnects

R Achar, MS Nakhla - Proceedings of the IEEE, 2001 - ieeexplore.ieee.org
With the rapid developments in very large-scale integration (VLSI) technology, design and
computer-aided design (CAD) techniques, at both the chip and package level, the operating …

A review of global modeling of charge transport in semiconductors and full-wave electromagnetics

RO Grondin, SM El-Ghazaly… - IEEE transactions on …, 1999 - ieeexplore.ieee.org
Models of semiconductor devices that combine complex transport models with full-wave
solutions of Maxwell's equations are reviewed. Both hydrodynamic and ensemble Monte …

FD-TD modeling of digital signal propagation in 3-D circuits with passive and active loads

M Piket-May, A Taflove, J Baron - IEEE Transactions on …, 1994 - ieeexplore.ieee.org
Most existing computer-aided circuit design tools are limited when digital clock speeds
exceed several hundred MHz. These tools may not deal effectively with the physics of UHF …

Electromagnetic interference (EMI) of system-on-package (SOP)

T Sudo, H Sasaki, N Masuda… - IEEE Transactions on …, 2004 - ieeexplore.ieee.org
Electromagnetic interference (EMI) issues are expected to be crucial for next-generation
system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency …

[图书][B] The VLSI handbook

WK Chen - 1999 - taylorfrancis.com
Over the years, the fundamentals of VLSI technology have evolved to include a wide range
of topics and a broad range of practices. To encompass such a vast amount of knowledge …

EMI from cavity modes of shielding enclosures-FDTD modeling and measurements

M Li, J Nuebel, JL Drewniak, RE DuBroff… - IEEE Transactions …, 2000 - ieeexplore.ieee.org
Electromagnetic interference (EMI) from slots and apertures resulting from coupling of
interior sources through enclosure cavity modes in a rectangular test enclosure is reported …

Progress in the methodologies for the electrical modeling of interconnects and electronic packages

AE Ruehli, AC Cangellaris - Proceedings of the IEEE, 2001 - ieeexplore.ieee.org
The rapid growth of the electrical modeling and analysis of the interconnect structure, both at
the electronic chip and package level, can be attributed to the increasing importance of the …

Full-wave analysis of packaged microwave circuits with active and nonlinear devices: An FDTD approach

CN Kuo, B Houshmand, T Itoh - IEEE transactions on …, 1997 - ieeexplore.ieee.org
This paper presents a comprehensive full-wave analysis of packaged nonlinear active
microwave circuits by applying the extended finite-difference time-domain (FDTD) method …

B1 field homogeneity and SAR calculations for the birdcage coil

TS Ibrahim, R Lee, BA Baertlein… - Physics in Medicine & …, 2001 - iopscience.iop.org
The finite-difference time-domain (FDTD) method is used to model a birdcage resonator. All
the coil components, including the wires, lumped capacitors and the source, are …

Computational analysis of the high pass birdcage resonator: finite difference time domain simulations for high-field MRI

TS Ibrahim, R Lee, BA Baertlein, Y Yu… - Magnetic resonance …, 2000 - Elsevier
In this work, a finite difference time domain (FDTD) algorithm is validated at 1.5 tesla using
the standard GE Signa quadrature head coil and a muscle phantom. The electrical …