Chip packaging engineering has evolved significantly to meet the performance demands of
integrated circuits (IC) and micro-electromechanical systems (MEMS). Layers, mainly …

Interfacial delamination is a critical factor for dissimilar bi-material interfaces in terms of
structural mechanical behavior and reliability. In this study, the mixed mode interfacial …

Microelectronics packages play a vital role in not only interconnecting the electronic signals
from the die to the printed circuit board (PCB), but also in protecting the chips during the …

A new characterization method for interfacial adhesion between die to die hybrid bonding
interface at chip level is developed to evaluate and analyze the adhesion strength. Die to …

This paper describes the use of the double cantilever beam (DCB) method for characterizing
the adhesion strength of interfaces in advanced microelectronic packages at room and high …

Adhesion strength of a thin film for electronic packaging was investigated. The effects of
temperature and loading rate on the adhesion were observed considering the viscoelasticity …

본 연구에서는 기성 photo solder resist (PSR) 를 다양한 소재를 활용하여 유전 특성이 우수한
소재로 개발을 진행하였다. 다양한 소재는 유전율이 낮은 소재 자체 개발품의 폴리이미드와 …

The I/O density growth of the system-on-chip (SoC) technology has been following Moore's
Law, which is approaching its limit due to physical node scaling challenges. 2.5 D …