Defects in graphene-based heterostructures: topological and geometrical effects

L Fan, J Xu, Y Hong - RSC advances, 2022 - pubs.rsc.org
The combination of graphene (Gr) and graphene-like materials provides the possibility of
using two-dimensional (2D) atomic layer building blocks to create unprecedented …

[HTML][HTML] Thermal transport property of boron nitride nanosheets

A Bhattacharjee, H Jiang, LH Li, S Huang… - Applied Physics …, 2024 - pubs.aip.org
The rapid progress of high-performance microelectronic devices underscores the urgent
necessity to develop materials possessing superior thermal conductivity for effectively …

An insight into thermal properties of BC3-graphene hetero-nanosheets: a molecular dynamics study

MZ Dehaghani, F Molaei, F Yousefi, SM Sajadi… - Scientific reports, 2021 - nature.com
Simulation of thermal properties of graphene hetero-nanosheets is a key step in
understanding their performance in nano-electronics where thermal loads and shocks are …

Interfacial Thermal Resistance Mechanism for the Polyaniline (C3N)–Graphene Heterostructure

K Einalipour Eshkalak, S Sadeghzadeh… - The Journal of …, 2020 - ACS Publications
The transport properties of hybrid nanostructures formed by graphene and polyaniline (C3N)
are investigated using molecular dynamics simulations. We systematically explored various …

Efficient modulation of thermal transport in two-dimensional materials for thermal management in device applications

F Duan, D Wei, A Chen, X Zheng, H Wang, G Qin - Nanoscale, 2023 - pubs.rsc.org
With the development of chip technology, the density of transistors on integrated circuits is
increasing and the size is gradually shrinking to the micro-/nanoscale, with the consequent …

Mechanical properties of C3N-BN hybrid nanosheets: Insights from molecular dynamics simulations

S Sadeghzadeh, L Badrinezhad… - Diamond and Related …, 2024 - Elsevier
Molecular dynamics simulations have been utilized to explore the mechanical properties of
the C 3 N-BN hybrid nanosheet across varying temperatures and strain rates, as well as in …

Phonon transport across GaN-diamond interface: The nontrivial role of pre-interface vacancy-phonon scattering

C Yang, J Wang, D Ma, Z Li, Z He, L Liu, Z Fu… - International Journal of …, 2023 - Elsevier
Diamond substrate with superior thermal conductivity has been the most promising heat sink
to solve the heat dissipation issues in GaN-based power electronics. The phonon transport …

Thermal conductivity and interfacial thermal resistance behavior for the polyaniline–boron carbide heterostructure

A Mayelifartash, MA Abdol… - Physical Chemistry …, 2021 - pubs.rsc.org
In this paper, by employing non-equilibrium molecular dynamics simulations (NEMD), the
thermal conductance of the hybrid formed by polyaniline (C3N) and boron carbide (BC3) in …

Toughening two-dimensional hybrid materials by integrating carbon nanotubes

L Fan, X Cai, H Wang, J Ye, Y Hong, J Ying - Surfaces and Interfaces, 2023 - Elsevier
Graphene (Gr) has ultra-high intrinsic strength and elastic modulus, but it is fragile and has
low fracture toughness. It is extremely difficult to evaluate the mechanical properties of two …

Preparation and properties of resin matrix composites reinforced by high thermal conductivity graphite films

Y Wang, K Wang, Z Ma, T Meng, R Cao… - Polymer …, 2024 - Wiley Online Library
High thermal conductivity graphite films (GFs) have a thermal conductivity, which have
attracted much attention in recent years. As the surface of GFs is extremely smooth, the resin …