Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many
applications owing to its distinct abilities. They include uniform deposition of conformal films …

Atomic layer deposition (ALD) relies on alternated, self-limiting reactions between gaseous
reactants and an exposed solid surface to deposit highly conformal coatings with a thickness …

Atomic layer deposition (ALD) is gaining attention as a thin film deposition method, uniquely
suitable for depositing uniform and conformal films on complex three-dimensional …

Plasma-assisted atomic layer deposition (ALD) is an energy-enhanced method for the
synthesis of ultra-thin films with Å-level resolution in which a plasma is employed during one …

Processing at the atomic scale is becoming increasingly critical for state-of-the-art electronic
devices for computing and data storage, but also for emerging technologies such as related …

The ability to achieve near-atomic precision in etching different materials when transferring
lithographically defined templates is a requirement of increasing importance for nanoscale …

The status and progress toward solid‐state 3D thin‐film Li‐ion microbatteries is reviewed.
Planar thin‐film batteries (TFBs) are commercially available. A major issue with planar TFBs …

With the continued miniaturization of devices in the semiconductor industry, atomic layer
deposition (ALD) of silicon nitride thin films (SiNx) has attracted great interest due to the …

As the nanoelectronics industry looks to transition to both three dimensional transistor and
interconnect technologies at the< 22 nm node, highly conformal dielectric coatings with …

The coating of complex three-dimensional structures with ultrathin metal films is of great
interest for current technical applications, particularly in microelectronics, as well as for basic …