When the integrated circuit (IC) feature size is reduced to 0.13 μm and below, copper (Cu)
becomes the new wiring material in interconnect materials. The double damascene process …

The objective of the current work was to evaluate the spectrum-effect relationships between
high-performance liquid chromatography fingerprints and analgesic and anti-inflammatory …

ABSTRACT A hybrid optimization approach using analytical hierarchy process (AHP)
combined with Taguchi-Grey has been developed and tested for the first time to optimize the …

Multi-axis ball-end milling is the most commonly used operation in machining aerospace
engine parts. Because of multi-output characteristic, the process improvement often requires …

The ambient air quality is a complex dynamical system that is shocked by a number of
subsystems, such as government policies, industry regulation adjustment and …

The Japanese government has promoted a number of policies regarding air pollution control
to regulate the maximum permissible limits of air pollution, including motor vehicles …

Retail location selection decision is a critical and complex process which requires the
evaluation and aggregation of multiple criteria and also the usage of appropriate data …

Present work focused on the impact of high temperature on the tribological properties for
thixoformed Al-5.7 Si–2Cu-0.3 Mg alloy. A pin-on-disc tribometer was used for dry sliding …

Silicon carbide (β-SiC) polishing aims to maximize material removal rate and surface quality.
Molecular dynamics (MD) simulations revealed β-SiC substrate removal methods with …

This study examines the alterations in the material properties and the effectiveness of the
nano-polishing process applied to the surface of AlN substrate material through molecular …