Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from
electrochemical migration (ECM) which significantly compromises the reliability of …

In this paper, the directional growth behavior of Sn whiskers was found to be associated with
the interfacial γ-Ag 2 Al IMCs at Sn-3.5 Ag/Al interface. A 100 μm thick columnar structured …

MAB/MAX phases with high corrosion resistances have gained significant attention because
of their promising in energy and catalysis applications. Sn/Zn whisker could grow on these …

In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic
grains and Sn whisker growth was investigated. In order to prevent the influence of the …

The effect of copper substrate roughness and tin layer thickness were investigated on
whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both …

The kinetics of Sn whisker growth was investigated on vacuum-evaporated Sn thin-films. Sn
film layers were deposited on a Cu substrate with 0.5 and 1 µm thicknesses. The samples …

In the past years, the use of low silver content SAC0307 (99Sn0. 3Ag0. 7Cu wt%) solder
alloy grew considerably due to its good soldering quality. In the latest version of this alloy …

Microalloying of elemental Pb is recognized in the electronics industry as the most effective
and reliable method for mitigating whisker growth. However, in this study, Pb was not found …

This paper presents an assessment of the effect of isothermal annealing of Sn whisker
growth behavior on the surface of Sn0. 7Cu0. 05Ni solder joints using the hot-dip soldering …

Since the environmental regulations of Reduction of Hazardous Substances (RoHS)
directive came into effect in Europe and Asia on July 1, 2006, requiring the removal of any …