Driven by the increasing demand for high-throughput communication links and high-
resolution radar sensors, the development of future wireless systems pushes at ever greater …

After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

Experimental investigation into the effect of tool electrode roughness on the geometric
characteristics of through-holes formed in glass substrate by electrochemical discharge …

Formation of multiple through-holes arrays in a 400 μm thick silica substrate is reported for
the first time by a cost-effective electrochemical discharge machining (ECDM). Customized …

The tool electrode feed rate (TEFR) is a parameter of vital importance for velocity-feed
electrochemical discharge drilling (ECDD). The tool electrode will hit the workpiece and may …

Glass structures with microchannel morphology play an important role in the fields of
biology, medicine and MEMS. The non-traditional machining methods currently used to …

Numerical and experimental analysis of high-aspect-ratio micro-tool electrodes fabrication
using a controlled electrochemical machining (ECM) technique is reported. The evolution of …

This paper presents a new method for wafer-level hermetic packaging of MEMS devices
using a relatively low temperature anodic bonding technique applied to the recently …

Glass has been proposed as a promising material for interposer because of its outstanding
material properties. The development of through-glass via (TGV) technology is the most …

To address the abating performance improvements from device scaling, innovative 2.5-D
and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) …