Microfabrication technologies initially developed for integrated electronics have been
successfully applied to batch-fabricate a wide variety of micromechanical structures for …

We investigate a method for fabricating layers that exhibit both high optical absorption and
promising thermoelectric properties. Using plasma-enhanced chemical vapor deposition …

The integration of complementary metal oxide semiconductor (CMOS) and
microelectromechanical systems (MEMS) can improve the performance of the MEMS, allows …

Surface modification of engineering materials allows the production of far superior products
in terms of reduced wear, increased corrosion resistance, better biocompatibility, and …

This paper reports on the use of p-type polycrystalline silicon germanium (poly-Si 1-x Ge x)
thin films as a new masking material for the cryogenic deep reactive ion etching (DRIE) of …

This chapter presents an overview of the key methods and process recipes commonly
employed in the deposition of semiconductor and dielectric thin films used in the fabrication …

This work gives an overview of the different developments for silicon germanium (Si1− xGex)
from a MEMS post-processing perspective. First, the maximum processing temperature that …

Chapter 4 gives an overview of the processing steps and process modules used in MEMS
manufacturing. Like IC fabrication, MEMS processing steps can be lumped into major …

One of the more significant technological achievements during the last twenty years has
been the development of the field of microelectromechanical systems (MEMS) and its …

This work demonstrates, for the first time, the use of a post deposition laser annealing
technique to realize operational SiGe MEMS devices at deposition temperatures as low as …