Semiconductor power modules are core components of power electronics in electrified
vehicles. Packaging technology often has a critical impact on module performance and …

In this paper, AlN ceramic was directly joined to copper without active brazing filler metal. By
exerting the nanosecond laser irradiation on the AlN surface, the AlN ceramic was thermally …

Thermal conductive insulating ceramic materials are urgently needed in the packaging
applications for modern electronic devices owing to their multi-functionality. The electrically …

We developed a newly-designed TiN/AgCuTi composite brazing alloy to significantly
improve the bonding strength of AlN/Cu composite ceramics, which can endow high power …

An estimated 70% of the electricity in the United States currently passes through power
conversion electronics, and this percentage is projected to increase eventually to up to …

Reactive air wetting and brazing of AlN ceramic were performed using Ag-(0single bond20)
at% CuO fillers. The wettability, joint mechanical properties and microstructural evolution …

Abstract “Lamellar” structure of hexagonal boron nitride (h-BN) is prone to the formation of
pore defects and the establishment of directional alignment during sintering process, which …

Beta-gallium oxide (-Ga 2 O 3) has attracted considerable attention for power devices due to
its superior properties and the availability of device-quality native substrates compared to …

Thermal Management of Gallium Nitride Electronics outlines the technical approaches
undertaken by leaders in the community, the challenges they have faced, and the resulting …

Driven by the global effort towards reduction of carbon dioxide emissions from cars, the
gradual phase out of fuel cars accompanied by the rise of electric vehicles (EVs) has …