In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC …

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …

First of all, semiconductor technology is out of the scope of this book and semiconductor
advanced packaging technology is the focus. In this chapter, the advanced packaging will …

In this paper, the warpage and thermal performances of fan-out wafer-level packaging
(FOWLP) are investigated. Emphasis is placed on the characterization of the effects of …

The design, materials, process, fabrication, and reliability of a heterogeneous integration of
four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this …

In this chapter, advanced packaging is defined. The kinds of advanced packaging are
ranked based on their interconnect density and electrical performance, and are grouped into …

This paper presents a comprehensive review of millimeter-wave (mm-wave) passive
bandpass filters (BPFs). A detailed discussion is provided on different topologies and …

A CPW dual-mode rectangular ring bandpass filter at 60 GHz using integrated passive
device (IPD) process is presented in this paper. Thick metal in IPD can give lower loss for …

In this chapter, the recent advances in multiple systemand heterogeneous integrationwith
TSV (through-silicon via)-less interposers (organic interposes or 2.3 D IC integration) will be …

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