The enabling technologies for the development of a flexible tag microlab for food monitoring
during the logistic chain will be presented. The realisation of the system includes the …

In this paper the design optimization of high performance conventional silicon-based
pressure sensors on flat diaphragms for low-pressure biomedical applications has been …

We report here a novel approach called microelectromechanical systems (MEMS) microflex
interconnect (MMFI) technology for packaging a new generation of bioMEMS devices that …

Monodispersed core–shell conductive particles are designed and produced as efficient
electron transporting materials for anisotropic conductive films. Traditionally, particle size …

We report on the coating of a 4-element integrated array of ultra low power hotplate (ULPH)
gas sensors with different metal oxide layers. The sensors are designed to be onboard of a …

A packaging technology for piezoresistive silicon pressure sensors is presented which is
based on the use of standard flip-chip bonding of the sensor die on a printed circuit board …

We report here a successful demonstration of a flip-chip packaging approach for a
microelectromechanical systems (MEMS) device with in-plane movable microelectrodes …

Generation of Anisotropic Conductivity in Polymer Films Using Localized Microvoids Formed by
Solvent Crazing as Nanoreactors | Chemistry of Materials ACS ACS Publications C&EN CAS …

The aim of this paper is to present an integrated process flow for a smart tag with integrated
sensors and RFID communication, a Flexible Tag Microlab (FTM). The heart of the designed …

Flip-chip packaging is desirable for microelectromechanical systems (MEMS) devices
because it reduces the overall package size and allows scaling up the number of MEMS …