Biosurfactants as a biological tool to increase micronutrient availability in soil: A review
Addressing micronutrient deficiencies in agricultural soils to meet the growing demands of
crops is a matter of great concern worldwide. The use of biosurfactant, a multifunctional …
crops is a matter of great concern worldwide. The use of biosurfactant, a multifunctional …
Corn hybrid response to in‐furrow starter fertilizer as affected by planting date
DE Kaiser, JA Coulter, JA Vetsch - Agronomy Journal, 2016 - Wiley Online Library
Use of in‐furrow starter fertilizer (IFSF) is common in the Upper Midwest to enhance early‐
season corn (Zea mays L.) growth because of cold soils in the early spring which limit P …
season corn (Zea mays L.) growth because of cold soils in the early spring which limit P …
The influence of the application technique and amount of liquid starter fertilizer on corn yield
The aim of this research was to study the impact of application technique and rate of liquid
starter fertilizer applied with a novel device on the production of corn. Starter fertilizer was …
starter fertilizer applied with a novel device on the production of corn. Starter fertilizer was …
Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
DJ Boday, J Kuczynski, RE Meyer III - US Patent 9,186,641, 2015 - Google Patents
An enhanced thermal interface material (TIM) gap filler for filling a gap between two
Substrates (eg, between a coldplate and an electronics module) includes microcapsules …
Substrates (eg, between a coldplate and an electronics module) includes microcapsules …
Microcapsules adapted to rupture in a magnetic field
DJ Boday, J Kuczynski, RE Meyer III - US Patent 8,741,804, 2014 - Google Patents
3.686. 930 A 8, 1972 Kniebes et al. merization. In one embodiment, microcapsules
encapsulat 3,936,976 A 2f1976 Porter et al. ing a fertilizer are applied during seed planting …
encapsulat 3,936,976 A 2f1976 Porter et al. ing a fertilizer are applied during seed planting …
The Potential of Microgranular Fertilizers to Reduce Nutrient Surpluses When Growing Maize (Zea mays) in Regions with High Livestock Farming Intensity
F Eulenstein, J Ahlborn, M Thielicke - Life, 2024 - mdpi.com
This contribution provides the first agroeconomic account of the application of a mineral
microgranular fertilizer and an organomineral microgranular fertilizer directly beneath the …
microgranular fertilizer and an organomineral microgranular fertilizer directly beneath the …
Flame retardant filler
DJ Boday, J Kuczynski, RE Meyer III - US Patent 8,900,491, 2014 - Google Patents
(57) ABSTRACT A flame retardant filler having brominated silica particles, for example,
imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs) …
imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs) …
Microcapsules adapted to rupture in a magnetic field
DJ Boday, J Kuczynski, RE Meyer III - US Patent 9,307,692, 2016 - Google Patents
Controlled release of one or more agricultural chemicals is provided by microcapsules
adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil …
adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil …
Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
DJ Boday, J Kuczynski, RE Meyer III - US Patent 9,434,133, 2016 - Google Patents
3,686,930 A 8, 1972 Kniebes et al. 3,748,827 A 7, 1973 Bulian et al. 3,936,976 A 2f1976
Porter et al. 3,956,179 A 5, 1976 Sebestian et al. 4,115,081 A 9, 1978 Ohno et al. 4.425, 117 …
Porter et al. 3,956,179 A 5, 1976 Sebestian et al. 4,115,081 A 9, 1978 Ohno et al. 4.425, 117 …
Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
DJ Boday, J Kuczynski, RE Meyer III - US Patent 9,694,337, 2017 - Google Patents
An enhanced thermal interface material (TIM) gap filler for filling a gap between two
substrates (eg, between a coldplate and an electronics module) includes microcapsules …
substrates (eg, between a coldplate and an electronics module) includes microcapsules …