Recent advances in thermal metamaterials and their future applications for electronics packaging
Thermal metamaterials exhibit thermal properties that do not exist in nature but can be
rationally designed to offer unique capabilities of controlling heat transfer. Recent advances …
rationally designed to offer unique capabilities of controlling heat transfer. Recent advances …
3D integrated circuit cooling with microfluidics
S Wang, Y Yin, C Hu, P Rezai - Micromachines, 2018 - mdpi.com
Using microfluidic cooling to achieve thermal management of three-dimensional integrated
circuits (ICs) is recognized as a promising method of extending Moore law progression in …
circuits (ICs) is recognized as a promising method of extending Moore law progression in …
Thermal design and constraints for heterogeneous integrated chip stacks and isolation technology using air gap and thermal bridge
This paper summarizes the thermal challenges in conventional 3-D stacks and proposes a
novel stacking structure that eases the thermal problem. The objective of this paper is first to …
novel stacking structure that eases the thermal problem. The objective of this paper is first to …
TAPAS: Temperature-aware adaptive placement for 3D stacked hybrid caches
3D integration enables large last level caches (LLCs) to be stacked onto a die. In addition,
emerging Non Volatile Memories (NVMs) such as Spin-Torque Transfer RAM (STT-RAM) …
emerging Non Volatile Memories (NVMs) such as Spin-Torque Transfer RAM (STT-RAM) …
Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems
Microfluidic cooling shows promise in cooling next generation 3D microsystems when
integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered …
integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered …
Electrical circuit modeling and validation of through-silicon vias embedded in a silicon microfluidic pin-fin heat sink filled with deionized water
H Oh, M Swaminathan, GS May… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
This article presents the electrical circuit model of signal-ground through-silicon vias (TSVs)
in a silicon microfluidic pin-fin heat sink in which the pin-fins are surrounded by deionized …
in a silicon microfluidic pin-fin heat sink in which the pin-fins are surrounded by deionized …
Thermal and electrical characterization of TSV interposer embedded with microchannel for 2.5 D integration of GaN RF devices
In this paper, a TSV interposer embedded with microchannel is proposed for 2.5 D
integration of GaN RF power device. S-shaped microchannel with symmetrical radial …
integration of GaN RF power device. S-shaped microchannel with symmetrical radial …
Parka: Thermally insulated nanophotonic interconnects
Y Demir, N Hardavellas - … of the 9th International Symposium on …, 2015 - dl.acm.org
Silicon-photonics are emerging as the prime candidate technology for energy-efficient on-
chip interconnects at future process nodes. However, current designs are primarily based on …
chip interconnects at future process nodes. However, current designs are primarily based on …
Ultralow thermal conductivity and thermal diffusivity of graphene/metal heterostructures through scarcity of low-energy modes in graphene
In many ultralow thermal conductivity materials, interfaces of dissimilar materials are
employed to impede heat flow perpendicular to the interfaces. However, when packed within …
employed to impede heat flow perpendicular to the interfaces. However, when packed within …
Therma: Thermal-aware run-time thread migration for nanophotonic interconnects
In this paper, we introduce Therma, a thermal-aware run-time thread migration mechanism
for managing temperature fluctuations in nanophotonic networks. Nanophotonics is one of …
for managing temperature fluctuations in nanophotonic networks. Nanophotonics is one of …