Nanometric cutting removes material at nanoscale and generates high-quality surfaces with
a nanometric finish. In past decades, it has thrived as a mainstream manufacturing …

Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Fused silica is widely used in precision optical devices for its excellent optical properties.
However, it has hard and brittle nature, becoming a difficult-to-process material. This makes …

Molecular dynamics (MD) simulation was employed in this study to elucidate the dislocation/
amorphization-based plasticity mechanisms in single crystal 3C–SiC during nanometric …

Gallium nitride (GaN) is an important third-generation semiconductor material. However, due
to its high hardness, high brittleness and anisotropy, the material removal efficiency of GaN …

Understanding the damage mechanism of silicon under interfacial shear is vital as it can
provide insights for the ultra-precision low damage machining. In this work, the nano …

Achieving nanometric surface on single-crystal silicon is important for semiconductor and
optoelectronics industries. In recent years, thermal assisted machining (hot machining) …

Single crystal silicon is necessarily subjected to mechanical precision machining to fulfill its
applications in semiconductor and optoelectronics industries. However, brittle defects are …

In this research, we performed molecular dynamics (MD) simulation to investigate the
material removal mechanism and subsurface damage formation during nano-scratching of …

Crystal orientation of the crystalline materials surfaces significantly affects the surface
generation and subsurface damage of the materials during the ultra-precision machining …