2020-06-10 Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG
ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT …

2020-12-18 Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
reassignment TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. ASSIGNMENT OF …

The present general inventive concept provides a flip-chip semiconductor package
configured to prevent a bump from being deviated from a bond site due to thermal …

The present invention provides a structure. In an exemplary embodiment, the structure
includes a base material, at least one metal pad, where a first surface of the metal pad is in …

Provided are a semiconductor device and a semiconductor package including the same.
The semiconductor device comprises a semiconductor chip body including a first chip pad …

A semiconductor package includes a semiconductor chip; a redistribution insulating layer
including a first opening; an external connection bump including a first part in the first …

There is provided an imaging device including: a first semiconductor substrate having a first
region that includes a photoelectric conversion section and a via portion, a second region …

A semiconductor die including mechanical-stress-resistant bump structures is provided. The
semiconductor die includes dielectric material layers embedding metal interconnect …

H01L23/538—Arrangements for conducting electric current within the device in operation
from one component to another, ie interconnections, eg wires, lead frames the …

A method includes forming a first dielectric layer, forming a first redistribution line comprising
a first via extending into the first dielectric layer, and a first trace over the first dielectric layer …