Microwave devices with reduced dielectric loss and electronic components with increased
integration density necessitate the higher performance of electronic packaging materials …

As electronic devices with high integration and reliability are developed, the need for
electronic packaging materials with good thermal conductivity, dielectric properties, and …

Stereolithography is an additive manufacturing process which makes it possible to fabricate
useful complex 3D ceramic parts with a high dimensional resolution and a good surface …

High-temperature cofired ceramics and low-temperature cofired ceramics are important
technologies in the fabrication of multilayer ceramic substrates for discrete devices …

In this study, a new-type dielectric substrate composed of MgTiO 3/CaO-B 2 O 3-SiO 2 (CBS)
dielectric ceramic composites was prepared via solid-state reaction. The sinterability …

A new glass with ultralow glass transition temperature based on 10Li2O–10Na2O–20K2O–
60MoO3 (LNKM) has been developed by conventional glass melting and quenching …

A series of new Li 2 SiO 3+ 4 wt% Al 2 O 3-xK 2 O–B 2 O 3–SiO 2 (x= 1–4 wt%) LTCC
materials were prepared by standard traditional solid-state method and their bulk density …

A new composition was developed using sintering to improve the dielectric properties of low-
temperature co-fired alumina (LTCA) containing CuO–TiO 2–Nb 2 O 5–Ag 2 O. By …

Alumina, thanks to its superior thermal and dielectric properties, has been the leading
substrate over several decades, for power and microelectronics circuits. However, alumina …

In this study, the performance of low-temperature sintered Bi–B–Si–Zn–Al glass/Al 2 O 3/SiC
nanowires composite fabricated by the tape casting method was systematically investigated …