Using microfluidic cooling to achieve thermal management of three-dimensional integrated
circuits (ICs) is recognized as a promising method of extending Moore law progression in …

Nowadays, artificial intelligence (AI) technology with large models plays an increasingly
important role in both academia and industry. It also brings a rapidly increasing demand for …

High in reliability, multi in function, and strong in tracking and detecting, active phased array
antennas have been widely applied in radar systems. Heat dissipation is a major …

Cooling is a significant challenge for high-performance and high-power 3-D ICs. In this
paper, tier-specific microfluidic cooling technology is proposed and experimentally …

In this paper, the impact of microfluidic cooling on the electrical characteristics of through-
silicon vias (TSVs) is investigated for three-dimensional (3-D) integrated circuits (ICs). The …

A silicon interposer platform utilizing microfluidic cooling is proposed to address the off-chip
signaling and cooling challenges facing future high-performance computing systems. A test …

To improve the capacities and capabilities of microelectronic devices, 3D packaging is an
attractive solution which can provide increased functional density at a decreased cost per …

To improve the capacities and capabilities of microelectronic devices, 3D packaging is an
attractive solution which can provide increased functional density at a decreased cost per …

Heat dissipation is a significant challenge for three-dimensional integrated circuits (3D IC)
due to the lack of heat removal paths and increased power density. In this paper, a 3D IC …

Just in few years, three-dimensional (3D) packaging technologies have attracted much more
attention. With the development of through-silicon via (TSV) technology, silicon-based …