The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

The increasingly complex packaging used in modern workstations and servers transmits a
complicated set of mechanical loads to the microprocessor. Increasing die size, high CTE …

Moisture has been one of the major concerns for package designers and reliability
researchers. It is well-known that high humidity combined with high temperature can cause a …

Plastic Ball Grid Array (PBGA) technology has been proven to be one of the most popular
packaging solutions with many advantages in thermo-electro-mechanical performance …

Moisture is a significant contributing factor to the failure of microelectronic packaging
including phenomena such as popcorn cracking, delaminations, and interfacial fracture …

In this study, an investigation has been performed on effects of moisture on die stresses in
240 pin Quad Flat Packs (QFPs). Stress sensing test chips were used to experimentally …

Stress sensing test chips are a powerful tool for measuring in-situ stresses in electronic
packages. In this study, we have applied (111) silicon test chips to perform a variety of …

Stress sensing test chips are a powerful tool for measuring in-situ stresses in electronic
packages. In this study, we have applied (111) silicon test chips to perform a variety of …

In this work, we have used test chips containing piezoresistive sensors to characterize the in-
situ die surface stress evolution during thermal cycling of flip chip ceramic ball grid array (FC …

In this work, an investigation has been performed on hygrothermally induced die stresses in
flip chip assemblies caused by moisture absorption by the underfill encapsulant. Silicon test …