Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic
packaging applications. Ag NPs have emerged as a promising low-temperature bonding …

Recently, nanosilver pastes have emerged as one of the most promising high temperature
bonding materials for high frequency and high power applications, which provide an …

The unique mechanical and physical properties of eutectic high entropy alloys (EHEAs)
have attracted increasing attention and research interest in design and development of new …

A kind of interface between power chip and heat sink with high interfacial strength and high
thermal conductivity was sintered by different Ag particles in this article. The results showed …

Ag nanopaste is one of the most promising die-attach materials in power devices. In this
work, robust sintered SiC devices are achieved by using graphene reinforced Ag nanopaste …

Ag–Cu bimetallic nanoparticles, combining the advantages of both Ag and Cu, are a
promising material for power electronic packaging. In this work, a supersaturated Ag–7.3 …

The development of next-generation power electronics requires the semiconductor power
devices with higher voltage endurance, higher electrical current density under high …

A new mixed nano paste consisting of silver nanoparticles, silver nanowires and copper
nanoparticles has been proposed as the active material in an alternative joining approach …

Sintered nano-copper is becoming a promising candidate as thermal interface material (TIM)
for die attaching in high power electronics. It exhibits much higher thermal conductivity and …

To meet the requirement of bonding power chips in microelectronic packaging, low
temperature sintering silver (Ag) nanopaste appears to be the most interesting choice in …