Abstract Field-Programmable Gate Arrays (FPGAs) have become one of the key digital
circuit implementation media over the last decade. A crucial part of their creation lies in their …

3D technology is an attractive solution for reducing wirelength in a field programmable gate
array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we …

This paper reviews the recent developments in monolithic 3-D field-programmable gate
arrays (FPGAs). Enabling technologies are covered. Three representative groups of …

The use of embedded multiplier blocks has become a norm in DSP applications due to their
high performance and low power consumption. However, as their implementation details in …

This paper describes a new programmable routing fabric for field-programmable gate arrays
(FPGAs). Our results show that an FPGA using this fabric can achieve 1.57 times lower …

Layout regularity is introduced progressively by integrated circuit manufacturers to reduce
the increasing systematic process variations in the deep sub-micron era. In this paper we …

The growth of 3D technology had led to opportunities for stacked multiprocessor-accelerator
computing platforms with high-bandwidth and low-latency TSV connections between them …

In this paper, we propose novel architectural and design techniques for three-dimensional
field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop …

In this article, a neural spin-orbit torque (NSOT)-based emerging device technology
reconfigurable fabric is developed and assessed as a low-leakage power alternative to the …

This paper proposes to use the high density of vias enabled by monolithic 3D integration to
produce multi-stack FPGA designs with improved performance and functionality. The use of …