Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films
AWS Ross, CM Dover, S Smith, JG Terry… - 2022 IEEE 34th …, 2022 - ieeexplore.ieee.org
This paper presents a previously documented full wafer test structure, designed to quantify
the effect of seed layer thickness and conductivity on the plating uniformity of patterned …
the effect of seed layer thickness and conductivity on the plating uniformity of patterned …
Automated Wafer-Level Characterisation of Electrochemical Test Structures for Wafer Scanning
I Schmueser, CL Mackay, F Moore… - 2020 IEEE 33rd …, 2020 - ieeexplore.ieee.org
This paper presents an automated system for the electrochemical characterization of micro-
scale test structures at the wafer level, with the objective to identify good devices suitable for …
scale test structures at the wafer level, with the objective to identify good devices suitable for …