In the present work, three near-eutectic lead-free solder melts of Sn-8wt.% Zn; Sn-8wt.% Zn-
2wt.% Bi and Sn-8wt.% Zn-4wt.% Bi have swiftly solidified by means of the melt-spinning …

Solders for ultrahigh-temperature applications were defined by Vianco as those able to
sustain working conditions with temperatures as high as 573 K, with momentary temperature …

In this article, a series of Sn–xZn solders are designed for joining Mg/Al dissimilar metals by
low temperature brazing. The effect of Zn content in Sn–Zn solders on microstructure …

Particle diameter and bed porosity change due to the expansion and contraction of metal
hydride particles during hydrogen absorption and desorption, which leads to variations in …

Abstract Four hypereutectic Sn-Zn alloys with 69.5, 48.3, 28.1 and 14.1 at% of Zn were
produced by mixing and melting of pure metals Sn and Zn followed by cooling in air to room …

Thermal expansion and electrical resistivity of alloys based on Sn-Zn eutectic with 0.5, 1.0,
1.5, and 4.0 wt.% additions of In were studied. Thermal expansion measurements were …

The variations of thermal conductivities of solid phases versus temperature for pure Sn, pure
Al and Sn–0.5 wt.% Al, Sn–2.2 wt.% Al, Sn–25wt.% Al, Sn–50wt.% Al, Sn–75wt.% Al binary …

Abstract As-cast Sn-8.8 wt.% Zn eutectic alloy was directionally solidified with a constant
temperature gradient (G= 4.16 K/mm) under various solidification rates (V= 8.3–790 μm/s) in …

A novel method of fabrication of gadolinia doped bismuth oxide nanoceramic via the sol–gel
technique is reported. Their thermal, structural and morphological properties are described …

Electromigration behavior in a one-dimensional Cu/Sn–8Zn–3Bi/Cu solder joint structure
was investigated in ambient with a current density of 3.5× 104 A/cm2 at 60° C. Due to the …