Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …

From the Publisher: This text treats the physical design of very large scale integrated circuits
gradually and systematically. It examines the design problem and the design process with …

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides
achieved in 3-D manufacturing technologies. Advanced design methodologies for two …

In this paper, we study the problem of layer assignment for via minimization, which arises
during multilayer global routing. In addressing this problem, we take the total overflow and …

Routing is one of the most complex stages in the back-end design process. Simple routing
algorithms based on two stages of global routing and detailed routing do not offer …

Three-dimensional (3-D) packaging via system-on-a-package (SOP) has been recently
proposed as an alternative solution to overcome the limitation of system-on-a-chip (SOC) …

There are a number of VLSI problems that have a common structure. We investigate such a
structure that leads to a unified approach for three independent VLSI layout problems …

Three-dimensional (3-D) packaging via system-on-package (SOP) is a viable alternative to
system-on-chip (SOC) to meet the rigorous requirements of today's mixed signal system …

Given a die with I/O pads wire bonded onto the multilayer substrates of a pin grid array
(PGA) package, a three-step net-even-wiring system (NEWS) is proposed to complete the …

We introduce a new multilayer routing strategy for high-performance MCMs whose objective
is to route all nets optimizing routing performance and to satisfy various design constraints …