[图书][B] Nanopackaging: Nanotechnologies and electronics packaging
JE Morris - 2018 - Springer
Level one electronics packaging is traditionally defined as the design and production of the
encapsulating structure that provides mechanical support, environmental protection …
encapsulating structure that provides mechanical support, environmental protection …
Resistance determination for sub-100-nm carbon nanotube vias
C Zhou, AA Vyas, P Wilhite, P Wang… - IEEE Electron …, 2014 - ieeexplore.ieee.org
We report resistance results from carbon nanotube (CNT) vias of widths from 150 to 60 nm
for potential application in integrated circuits technology. Selective CNT growth inside the …
for potential application in integrated circuits technology. Selective CNT growth inside the …
Carbon nanotube enhanced CMOS interconnect
This paper describes the potential of using carbon nanotube (CNT) as a via-filling material to
enhance the performance mainstream CMOS technology. Due to the CMOS compatibility …
enhance the performance mainstream CMOS technology. Due to the CMOS compatibility …
[引用][C] Carbon nanotube-reinforced metal matrix composites as novel electrodes for low-voltage switching applications: A surface degradation analysis
Carbon Nanotube-reinforced Metal Matrix Composites as Novel Electrodes for Low-voltage
Switching Applications: A Surface Degrada Page 1 Carbon Nanotube-reinforced Metal Matrix …
Switching Applications: A Surface Degrada Page 1 Carbon Nanotube-reinforced Metal Matrix …