This review covers recent advances and work on the microstructure features, mechanical
properties and cracking processes of conducting polymer film/coating-substrate structures …

Fracture toughness testing of materials at the micrometer scale has become essential due to
the continuing miniaturization of devices accompanied by findings of size effects in fracture …

This paper reports on the design, fabrication, and testing of a low-actuation voltage
Microelectromechanical systems (MEMS) switch for high-frequency applications. The …

Directed-assembly of nanowire-based devices will enable the development of integrated
circuits with new functions that extend well beyond mainstream digital logic. For example …

The ultra-thin flexible polyimide neural probe can reduce the glial sheath growth on the
probe body while its flexibility can minimize the micromotion between the probe and brain …

Digital holographic microscopy (DHM) can be described as a non-invasive metrological tool
for inspection and characterization of microelectromechanical structures (MEMS). DHM is a …

This bibliography contains references to papers, conference proceedings and
theses/dissertations dealing with machining simulated by the finite element methods that …

The coefficient of thermal expansion (CTE) is an important mechanical property for thin film
materials. There are several problems that arise from the thermal expansion effect; for …

DOI: 10.1002/adma. 201503423 materials cannot provide long-term and robust interfaces
with neurons, neural fascicles, and nerves. The mechanical mismatch between these stiff …

We have measured the Young's modulus, residual stress, and stress gradient of
electroplated gold thin films using surface micromachined beam structures. Cantilever and …