Direct visualization of the drug loading of single DNA origami nanostructures by AFM-IR nanospectroscopy
The efficient loading of DNA nanostructures with intercalating or groove-binding drugs is an
important prerequisite for various applications in drug delivery. However, unambiguous …
important prerequisite for various applications in drug delivery. However, unambiguous …
Nano-FTIR and chemical force analysis of electrografted aryldiazonium salts on ODT-microcontact printed Au-surfaces
J Su, AG Orive, G Grundmeier - Applied Surface Science, 2023 - Elsevier
The aim of this work is the analysis of pH-dependent adhesion on micropatterned
electrografted aryldiazonium salts on gold substrates. A PDMS stamp inked with 1 …
electrografted aryldiazonium salts on gold substrates. A PDMS stamp inked with 1 …
A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier
Amino-terminated, self-assembled monolayers (NH 2-SAMs) are widely used for seeding in
electroless metallization, and activation is typically performed in an acidic aqueous …
electroless metallization, and activation is typically performed in an acidic aqueous …
All-wet encapsulation and electroless superfilling process for the fabrication of self-assembled-monolayer encapsulated copper interconnects with enhanced …
GS Chen, CE Lee, TM Yang, YL Cheng, JS Fang - Materials Letters, 2021 - Elsevier
The continued downscaling of integrated circuits has brought into focus the development of
new molecularly thick barrier/capping materials and novel fabrication processes for Cu …
new molecularly thick barrier/capping materials and novel fabrication processes for Cu …
Synergy of mercaptosilane monolayer embedding and extremely dilute cobalt alloying for metallization of copper without a conventional metallic barrier
GS Chen, WL Gao, CC Chang, JS Fang… - Materials Chemistry and …, 2021 - Elsevier
TaN/Ta bilayer is the standard barrier for the metallization of copper interconnects of current
integrated circuit devices. However, thickness reduction of the barrier becomes a major …
integrated circuit devices. However, thickness reduction of the barrier becomes a major …
Analysis of Adsorbates and Interfacial Forces at Metal Oxide Interfaces at Defined Environmental Conditions
AG Orive, C Kunze, B Torun, T de los Arcos… - Particles in Contact …, 2019 - Springer
This work addresses the investigation of single particle contact forces and molecular forces
on the basis of a detailed understanding of the adsorbate-particle interfacial structure. Oxide …
on the basis of a detailed understanding of the adsorbate-particle interfacial structure. Oxide …