We have developed a single-wafer vacuum encapsulation for microelectromechanical
systems (MEMS), using a thick (20-mum) polysilicon encapsulation to package …

A glass vacuum package based on localized aluminum/silicon-to-glass bonding has been
successfully demonstrated. A constant heat flux model shows that heating can be confined …

Packaging of micro-electro-mechanical systems (MEMS) devices has proven to be costly
and complex, and it has been a significant barrier to the commercialization of MEMS. We …

Microassembly promises to extend MEMS beyond the confines of silicon micromachining.
This paper surveys research in both serial and parallel microassembly. The former extends …

In this paper, we present a low temperature wafer-level encapsulation technique to
hermetically seal adhesive bonded microsystem structures by cladding the adhesive with an …

Although MEMS technologies and device structures have made significant progress in the
past three decades and have found widespread application in many areas, including Micro …

(57) ABSTRACT A micromechanical device includes a single crystal micro machined
micromechanical Structure. At least a portion of the micromechanical Structure is capable of …

This paper presents a packaging technology that employs an electroplated nickel film to
vacuum seal a MEMS structure at the wafer level. The package is fabricated in a low …

A variety of microelectromechanical system devices requires encapsulation of their crucial
fragile parts in a hermetically sealed cavity for reasons of protection. Hermeticity of the cavity …

(57) ABSTRACT A low temperature method for forming a microcavity on a Substrate and
article having same are provided which utilize electroplated films. The method is particularly …