Few researchers have studied high metal ions concentration electroless plating solutions
since increasing metal ions concentration shortens the solution life considerably …

This article presents a novel bonding method for chip packaging applications in the
semiconductor industry, with a focus on downsizing high-density and 3D-stacked …

The electroless deposition of copper uses a catalytic redox reaction between metal ions and
a dissolved reducer (usually formaldehyde) at high temperatures in an alkaline environment …

In recent years, the specificity of the demand for selective, adaptable and inexpensive
methods has always been one of the key factors in support of further research on electroless …

This paper presents the process of preparation and characterisation of chemically deposited
copper coatings on ZrW2O8 particles. The interest in this topic is driven by the possibility of …

The electroless plating method is the most convenient for the metallisation of dielectrics.
During this statistical study of the process, complex relationships were found between the …

In this paper the influence of the thickness of electroless copper layers on the uniformity of
electrochemical thickening is investigated. Three different electroless baths are used and …

In the present work, the process of electroless deposition of Cu-Ni-P alloy layers using liner
sweep voltammetry has been studied. The influence of temperature, pH of the electrolyte, as …