In this paper, we propose a low-loss assembly of optical elements [vertical cavity surface
emitting laser (VCSEL)/photodiode (PD)] and a 90°-bent graded-index (GI) core polymer …

In this study, we propose a solution for realization of surface emitting, 2D array of visible light
laser diodes based on AlInGaN semiconductors. The presented system consists of a …

Based on gray-tone optical lithography technology combined with the overlay alignment
method, a spherical concave micro-mirror is fabricated at the end of a rectangular optical …

The chip-level 1× 2 optical interconnects using the polymer vertical splitter developed on a
silicon substrate are demonstrated. The 1× 2 vertical-splitting configuration is realized using …

3.2T Co-Package Optics (CPO) Module Based on 200G/ch Silicon-Organic-Hybrid (SOH)
Mach-Zehnder Modulator (MZM) Page 1 Abstract—In this work, we will show experimental data …

A polymer-waveguide-based optical circuit with two vertical-transition output ports for the
optical interconnects is demonstrated on a silicon substrate. Such a 1× 2 vertical splitter is …

We experimentally demonstrated 53.5625 Gb/s X 4-ch optical interconnect module based on
a silicon interposer, where 4 directly-modulated-lasers (DML) lasers with 20-nm wavelength …

Trenches on silicon have found important applications in microelectromechanic system,
microfluidic devices, photonic devices, capacitor memory devices and etc. Etching trenches …

Buried optical interconnects promise high speed interconnections between electronic
circuits on circuit boards. Previous attempts have relied on expensive microfabrication …

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate
Page 1 M2K.4.pdf OFC 2014 © OSA 2014 Chip-level 10-Gbit/s optical interconnects using 1 × …