Reliability issues of lead-free solder joints in electronic devices
N Jiang, L Zhang, ZQ Liu, L Sun, WM Long… - … and technology of …, 2019 - Taylor & Francis
Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …
which undoubtedly puts forward higher requirements for the reliability of solder joints in …
Effect of thermal-shearing cycling on Ag3Sn microstructural coarsening in SnAgCu solder
L Qi, J Huang, X Zhao, H Zhang - Journal of Alloys and Compounds, 2009 - Elsevier
Microstructures of Ag3Sn particles, formed around Cu6Sn5 intermetallic compound (IMC)
and in a lead-free solder (Sn3. 5Ag0. 5Cu), changes significantly under thermal-shearing …
and in a lead-free solder (Sn3. 5Ag0. 5Cu), changes significantly under thermal-shearing …
Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint
AU Telang, TR Bieler, A Zamiri, F Pourboghrat - Acta Materialia, 2007 - Elsevier
A single shear lap solder joint specimen with lead-free eutectic Sn–Ag solder on copper
substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between− 15°(3.5 …
substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between− 15°(3.5 …
Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy
L Wang, DQ Yu, J Zhao, ML Huang - Materials letters, 2002 - Elsevier
The influence of mixture (La, Ce) rare earth elements (RE) on wettability and tensile property
in Sn–3.5 Ag solder alloy was investigated. The wetting property was improved by 0.25 …
in Sn–3.5 Ag solder alloy was investigated. The wetting property was improved by 0.25 …
Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders
J Zhao, Y Mutoh, Y Miyashita, SL Mannan - Journal of Electronic Materials, 2002 - Springer
Fatigue crack-growth behavior and mechanical properties of Sn-3Ag-0.5 Cu, Sn-3Ag-0.5 Cu-
1Bi, and Sn-3Ag-0.5 Cu-3Bi solders have been investigated at room temperature (20° C) …
1Bi, and Sn-3Ag-0.5 Cu-3Bi solders have been investigated at room temperature (20° C) …
[HTML][HTML] Thermo-mechanical fatigue induced unexpected strain hardening of Cu clip wiring on transfer-mold type EV power modules
D Kim, S Noh, S Park, MS Kim - International Journal of Fatigue, 2023 - Elsevier
Power modules subjected to cyclic power operation experience thermomechanical fatigue.
Herein, the epoxy molding compounds and creep behaviors of solder joints promoted the …
Herein, the epoxy molding compounds and creep behaviors of solder joints promoted the …
Anisotropic crystal plasticity finite element modeling of the effect of crystal orientation and solder joint geometry on deformation after temperature change
A Zamiri, TR Bieler, F Pourboghrat - Journal of electronic materials, 2009 - Springer
The crystal orientation of the tin phase in a Pb-free Sn solder joint has a significant effect on
the stress state, and hence on the reliability of the solder joint. A set of crystal plasticity …
the stress state, and hence on the reliability of the solder joint. A set of crystal plasticity …
Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony
Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling
performance in harsher conditions. Here, we investigate microstructure evolution and failure …
performance in harsher conditions. Here, we investigate microstructure evolution and failure …
The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5 Cu/Cu during soldering
X Liu, M Huang, Y Zhao, CML Wu, L Wang - Journal of alloys and …, 2010 - Elsevier
The interfacial reactions between Sn–3Ag–0.5 Cu solder and Cu substrate at 250° C and
300° C from 30s up to 1800s were investigated. The average size of the Ag3Sn nano …
300° C from 30s up to 1800s were investigated. The average size of the Ag3Sn nano …
Mechanical fatigue of Sn-rich Pb-free solder alloys
KN Subramanian, JK Shang, QL Zeng, L Zhang… - Lead-Free Electronic …, 2007 - Springer
Recent fatigue studies of Sn-rich Pb-free solder alloys are reviewed to provide an overview
of the current understanding of cyclic deformation, cyclic softening, fatigue crack initiation …
of the current understanding of cyclic deformation, cyclic softening, fatigue crack initiation …